170 pts Mini Breadboard Solderless SYB-170 Tie Points is named for its 170 tie points. It has 17 columns of 10 holes, which are separated into two pairs by a central notch, and labeled 1 to 17. Each column is also labeled, with a letter from A to J to that they can be easily referenced in instructio..
Breadboard GL-12 840 Tie Points is a construction base for prototyping of electronics. The term "breadboard" is commonly used to refer to a solder less breadboard.
Features of Breadboard (Full Size):Size is typically 0.1 in (2.54 mm).Integrated circuits (ICs) in dual in-line packages (DIPs..
400 Tie Points Contacts Mini Circuit Experiment Solderless Breadboard are commonly used for prototyping because they allow you to quickly build temporary circuits without soldering. Breadboards accept most through-hole parts and up to #22 wire. When you’re done or want to change your circuit, it’s e..